PCB Assembly

With professional and productive pcb assembly factory, Mingyangxing Electronics is one of the top level smt assembly, pcb assemblies, circuit assembly, smt pcb assembly, electronic assembly, custom pcb assembly, prototype pcb assembly, electronic pcb assembly, pcb assembly service manufacturers and suppliers. Welcome to wholesale products from us.TYPE:pcb assemblyDIP serviceresistance/ capacitance/diode/transistor/ IC / IC socket.etc.SMT service0201/0402/0603/1206/particularity,etcTest typeAvailable on requestCasing materialMetals/plastic/custom-madeBusiness Type:ManufacturersPacking  　Standard export packing:1.Standard :antistatic bays ,vacuum package,customized package.2.Standard:K=K cartonDelivery time: 7-15 days after receipt depositOrder flow1.Check out:checkout and make payment for selected products2.Upload file:please compress the files into one zip-file and upload it3.Tech confirm: check every details for the files and communication4. System:track everything in on place5.shipping:please feel free to tell us do you like the experience or notOEM Services :Pcb assembly : SMT/RTH/InspectPcba and pcb designComponents sourcing and purchasingQuick prototypingPlastic inection moldingMetal sheet stamping/die castingFinal assemblyTest: AOI ,In-Circuit Test,Functional TestRequested information for pcb assembly1.Gerber file of the bare pcb board2.BOM for assembly(bill of material)3.Testing Guide & Test file4.Programming files&programming file5.Schematic if necessary6.Clear Pic. Of PCB or PCBA sample if availableContract Printed Circuit Board (PCB) Assembly Services Specifications CategoryDescriptionCapability  SMT CapabilityQty of SMT Line5SMT Capacity35 Millions Per DayMax Board Size457mm × 610mmMin. Coponent Size0201BGA/μBGA AvailableDIP CapabilityQty of DIP Line3DIP Capacity0.2 Millions Per DayMax Board Width400 mmLead-free LineAvailableMax. Degree399 °CSpray Flux Add-onAvailableTechnical DataStencil Size736mm × 736mmMin. IC Pitch0.3mmMax. IC Size50mmMax. PCB Size1200mm × 500mmMin. PCB Thickness0.35mmMin. Chip Size0201Max. BGA Size74mm × 74mmBGA Ball PitchMin. : 1.0mm  Max. : 3.0mmBGA Ball DiameterMin. :  0.4 mm  Max. : 1.0mmOFP Lead PitchMin. :  0.38 mm  Max. : 2.54mmTurn TimesQuick turn are our specialtyAssembly TypeSurface Mount(SMT) AssemblyThru-Hole AssemblyMixed(Surface Mount and Thru-Hole)Cable AssemblyBox Build AssemblyTechnical DataStencilLaser Cut Stainless SteelPart ProcurementsTurnkey(We supply the Part)Consigned(You Supply the Parts)You Supply some part,we do the restSolder TypeLeadedLead-free/RoHS CompliantOther CapabilitiesRepair/Rework ServiceMechanical AssemblyMould and Plastic InjectionMaterial SourcingTest and InspectionAOI TestX-Ray InspectionIn-Circuit TestSolder Paste InsepctATE TestVibration TestTemp. & Humidity TestFunction TestCertificationISO 9001 ,